ELP WS-02T is UV curable adhesive tape. It supports the dicing process of semiconductor wafer manufacturing. Before UV curing, the tape holds the wafer firmly at dicing process. After UV curing, the tape releases die easily at diebonding process.
 |
| Thickness [mm] | Width [mm] | Length [m] | Color |
| 0.088 | 300,400 | 100 | half transparent |
| Item | Unit | ELP WS-02T
|
|
| Thickness | mm | 0.087 | |
| Adhesive strength on Siwfer
|
Before UV
|
N/20mm
|
4.36 |
| After UV
|
N/20mm
|
0.03 | |
영업시간 (한국시간) 09:00-17:00(토∙일 공휴일 제외)
Adobe Reader is required to view PDF files.
If not yet installed, please download it from the Adobe website.
