Features

• FOUP/Open cassette available
• Stable peeling performance by Peeling Trigger
• Low stress peeling by accurate control of Peeling bar
• Easy operation by Touch panel & Recipe function
• Log file function standard equipment
• Follow to CE mark / SEMI S2/S8
• Adding Wafer mapping scanner available
• Adding SECS/GEM available

Basic spesifications

Features

• 8""/6""/5"" wafer available
  4"" wafer handling (Option)
• Table heating function
• Thin wafer available (TW version)
• Easy operation by Touch panel
• Follow to CE mark
• Adding SECS/GEM available

Features

• 8""/6""/5""/4"" wafer available
• 8""- 4"" wafer handling available by 1 table
• Easy operation by Touch panel
• Follow to CE mark / SEMI S2/S8"

Basic spesifications

• Applicable wafer size：　8/6/5/4 inch
• Applicable wafer thickness：　250um or more
• Throughput：　App.50sec.／wafer

Features

• Peeling the protection tape from Wafer-mount-frame
• 8"/6"/5"/4" wafer available
• 8" frame available（6" frame: Option）
• 8"- 4" wafer handling available by 1 table
• Peeling protection tape from stand-alone wafer (Option)
• Easy operation by Touch panel
• Follow to CE mark & SEMI S2/S8

Basic spesifications

• Applicable frame size：　8 inch, (6 inch: Option)
• Applicable wafer size：　8/6/5/4 inch
• Applicable wafer thickness：　100um or more、　250um or more（for stand-alone wafer)
• Throughput：　50sec.／wafer