Engineered for EMI/RFI shielding on small electro-magnetic components. Bright, clean electro-deposited copper foil is soft annealed for improved conformability making it ideal in aerospace and electrical markets.
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| BACKING MATERIAL | Electro-deposited Copper Foil |
|---|---|
| ADHESIVE | Acrylic, thermosetting, solvent resistant, interlined |
| COLOR | Copper |
| INSULATION CLASS | 311°F/155°C |
| CERTIFICATIONS | UL-510 |
| GOVERNMENT SPECIFICATION | ASTM E595 |
| IMPERIAL | METRIC | |
|---|---|---|
| TOTAL TAPE THICKNESS | 3.2 mils | 0.081 mm |
| TENSILE STRENGTH | 65 lbs/in | 114 N/10mm |
| ELONGATION | 5% | 5% |
| ADHESION TO STEEL | 65 oz/in | 7.1 N/10mm |
Business Hours(Singapore time)08:30 to 17:30 Except Sat, Sun & Public Holidays
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TEL +65-6879-3811
FAX +65-6274-7432
Business Hours(Singapore time)08:30 to 17:30
Except Sat, Sun & Public Holidays
