Nitto Semiconductor Wafer Tape SWT 10T+R is designed for semiconductor dicing processes. This product consists of a clear transparent PVC film coated with a pressure sensitive acrylicbased adhesive manufactured in clean room environment. For easy unwind, the backing of the PVC-film is coated with a silicone release. The product is wound on a plastic core. Rolls are individually packed in a double polyethylene anti-static bag and foreseen with lot number.
| Film type | Plasticized PVC Film | |
| Adhesive type | Acrylic-based | |
| Total thickness | 0.130 mm | EN 1942 |
| Carrier thickness | 0.120 mm | |
| Adhesive thickness | 0.010 mm | |
| Adhesion to Si-wafer | 120 cN/20 mm | JIS Z 0237* |
| Unwind force | 60 cN/20 mm | EN 1944 |
| Tensile strength MD | 90 N/20 mm | EN 14410 |
| Elongation MD | 270 % | EN 14410 |
| Ionic Impurities | < 3 ppm | Ion Chromatography Analysis** |
| Colour | Transparent | |
| Transport and storage conditions | Temperature 15 to 30°C | |
| Relative humidity 40 to 75% RH |
*Measured on CZ-N Polished Wafer 4 inch (100) 2.5-3.5 (Shinethu Handoutai co.). Peel-off angle 90°.
**(Na+, K+, Cl-, NO2-, NO3-, PO43-, SO42-).
CAUTION: The above are typical values and should not be used in writing specifications.
Details from the test methods are described on the customer product specification.
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