Nitto Semiconductor Wafer Tape SWT 10+R is designed for semiconductor dicing processes. This product consists of a blue transparent PVC film coated with a pressure sensitive acrylicbased adhesive manufactured in clean room environment. For easy unwind, the backing of the PVC-film is coated with a silicone release. The product is wound on a plastic core. Rolls are individually packed in a double polyethylene anti-static bag and foreseen with lot number.
| Film Type | Plasticized PVC Film | |
| Adhesive type | Acrylic-based | |
| Total thickness | 0.075 mm | EN 1942 |
| Carrier thickness | 0.065 mm | |
| Adhesive thickness | 0.010 mm | |
| Adhesion to Si-Wafer | 120 cN/20 mm | JIS Z 0237* |
| Unwind force | 60 cN/20 mm | EN 1944 |
| Tensile strength MD | 55 N/20 mm | EN 14410 |
| Elongation MD | 260 % | EN 14410 |
| Impurities content | < 3 ppm | Ion Chromatography Analysis |
| Colour | Blue transparent | |
| Transport and storage conditions | Temperature 15 to 30°C | |
| Relative humidity 40 to 75% RH |
* Measured on CZ-N Polished Wafer 4 inch (100) 2.5-3.5 (Shinethu Handoutai co.). Peel-off angle 90°.
Details from the test methods are described on the customer product specification.
CAUTION: The above are typical values and should not be used in writing specifications.
Adobe Reader is required to view PDF files.
If not yet installed, please download it from the Adobe website.
TEL +32-89-360111
Business Hours (WET) 8:00h-17:00h
Except for Sat, Sun, and Holidays
Nitto is present in 14 countries in the EMEA region. Find your local contact details here.
