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Wafer Mounter (Full-auto type) NEL SYSTEM™

This equipmet is full-auto type Wafer mounter, applies dicing tape on wafer back side / dicing frame, and removes protection tape from wafer patterned surface.

MA3000III

MA3000Ⅲsemicon_backgrinding_img_icon_ce

Full-auto Wafer Mounter for 300mm wafer

Operation flow

Features

  • FOUP/Open cassette available
  • Thin wafer available
  • In-line system available (Option)
  • Small footprint (Industry smallest)
  • Improved protection tape peeling performance
  • Easy operation by Touch panel & Recipe function
  • Log file function standard equipment
  • Adding Wafer mapping scanner available
  • Adding SECS/GEM available
  • Follow to CE mark / SEMI S2/S8

Basic spesifications

  • Applicable frame size：　300mm／200mm
  • Applicable wafer size：　300mm／200mm
  • Applicable wafer thickness：　30um or more (Inline system),  50um or more (Stand-alone)
  • Throughput：　Roll tape: 40wafers/hr.　　Pre-cut tape: 45wafers/hr.
  • *Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
    In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.

MA2008IIR/ MA2008IIP

MA2008IIR/ MA2008IIPsemicon_backgrinding_img_icon_ce

Full-auto Wafer Mounter for 200mm wafer

Operation flow

Features

  • Combination of various applications are available:
  • DSC, Coin-stack
    • Non-contact arm, Non-contact table
    • Protection tape peeling / UV irradiation
    • Panel mounting
  • MA2008IIR:  for Roll tape
  • MA2008IIP:  for Pre-cut tape
  • Easy operation by Touch panel & Recipe function
  • Log file function standard equipment
  • Adding Wafer mapping scanner available
  • Adding SECS/GEM available
  • Follow to CE mark / SEMI S2/S8"

Basic spesifications

  • Applicable frame size：　8 inch／6 inch
  • Applicable wafer size：　8／6／5／4 inch
  • Applicable wafer thickness：　200um or more（Contact table）、250um or more（Non-contact table）
  • Throughput：　MA2008IIR：75wafers/hr. MA2008IIP：70wafers/hr.
  • *Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
  • In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.
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