Fluoroplastic (PTFE) Film with Excellent Heat Resistance, Mold Release, Insulation, Chemical Resistance.

Semiconductor Production Process Film NITOFLON™

Thermal Release Sheet for Electronic Component Processing

Tightly adheres and can easily be peeled off just by heating; perfect for temporary fixing.

Multi-purpose Curing Tape

A new type of curing tape suitable for various purposes.

Surface Protective Materials

Masking/surface protection material developed for leading-edge electronics and optical fields.

Surface Protective Materials

Low contamination type developed for surface protective of electronic and optical parts.

Surface Protective Materials

Optical grade protective material with an antistatic property produced in a class 1000 clean environment.

Surface Protective Materials

Surface protective materials with an antistatic properties that are ideal for applications that do not tolerate static electricity such as LCD panels.

Thermal Release Tape For Hard Substrate

Capable of processing brittle wafer.

Heat Resistance Back Grinding Tape

Back-grinding tape with heat resistance is for special heating process after wafer grinding.

Dicing Tape Line-up

Low adhesion release and UV release. Outstanding characteristics support the dicing process of wafer manufacturing.

Single Surface Treated Fluoroplastic (PTFE) Film