HR-S051 is a release film compounded polyimide film with fluoroplastic (PTFE) layer. This film has thermal stability from PI (polyimide) with excellent releasability of PTFE. It has splendid heat resistance, mechanical strength, dimensional stability, and releasability. Thin film allows remarkable thermal and electric conduction, and still able to be used in high temperature environment more than 300℃.
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| Item | Unit | Characteristic value | |
|---|---|---|---|
| Thickness | mm | 0.03 | |
| Tensile strength | MPa | 205 | |
| Elongation | % | 50 | |
| Surface roughness (Rmax) | um | 0.5~1 | |
| Thermal conductivity | W/(m-k) | 0.15 | |
|
Dimensional change rate
|
MD | % | -0.04 |
| TD | -0.02 | ||
| Heat Resistance
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Sliding Properties
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Electrical Insulation
|
| Chemical Resistance
|
Mold Release Properties
|
Weather Resistance
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