Double Sided Tape for Lead-free Soldering, Offering Excellent Heat-resistant and Repulsion Resistant Properties No.585

Ubstrate-included/heat-resistant double sided thin adhesive tape. Double sided adhesive tape with superior adhesion to applications with high repulsive force such as FPC bending.

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Brochure

Datasheet

SDS

Brochure

Double_Sided_Tape_en

Datasheet

NJ_No.585_EN

SDS

The information contained herein is based on all the documentation, information and data that can be obtained as of the date issued.

However, Nitto Denko Co., provides no warranties or guarantees, express or implied, regarding the accuracy or completeness of the information on contained amount, physical or/and chemical properties, and hazards or/and harm mentioned herein.

As for SDS of products categorized as "Article", Nitto Denko Co., voluntarily creates and releases the SDS for the particular products which frequently receive inquiries.

SDS_NJ_NO585_E

Features
Structure
Properties
Applications

Features

Superior adhesiveness to applications with high repulsive force such as FPC bending.
High shard removal processability/usage during die-cutting process.
Can be soldered with the release liner attached. (heat resistant release liner)
Double release liner type is also available. （Product: No.585W）

Structure

Properties

180° peeling strength [N/20mm] (to polyimide film)	13
Liner peeling strength [N/50mm]	0.9
Liner peeling strength after reflow [N/50mm]	1.3

[Remarks]

Note) Reflow condition: peak temp 250℃
* Measured by peeling in a 180° direction at a speed of 300 mm/min with 0.025 mm PET lining.
* The figures are a sample of observed values, not guaranteed performance.