This equipmet is full-auto type Wafer mounter, applies dicing tape on wafer back side / dicing frame, and removes protection tape from wafer patterned surface.
Applicable wafer thickness： 30um or more (Inline system), 50um or more (Stand-alone)
Throughput： Roll tape: 40wafers/hr. Pre-cut tape: 45wafers/hr.
*Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.
MA2008IIR/ MA2008IIP
MA2008IIR/ MA2008IIP
Full-auto Wafer Mounter for 200mm wafer
Operation flow
Features
Combination of various applications are available:
DSC, Coin-stack
Non-contact arm, Non-contact table
Protection tape peeling / UV irradiation
Panel mounting
MA2008IIR: for Roll tape
MA2008IIP: for Pre-cut tape
Easy operation by Touch panel & Recipe function
Log file function standard equipment
Adding Wafer mapping scanner available
Adding SECS/GEM available
Follow to CE mark / SEMI S2/S8"
Basic spesifications
Applicable frame size： 8 inch／6 inch
Applicable wafer size： 8／6／5／4 inch
Applicable wafer thickness： 200um or more（Contact table）、250um or more（Non-contact table）
Business Hours (WET) 8:00h-17:00h Except for Sat, Sun, and Holidays
Nitto is present in 14 countries in the EMEA region. Find your local contact details here.
Business Hours (WET) 8:00h-17:00h Except for Sat, Sun, and Holidays
Nitto is present in 14 countries in the EMEA region. Find your local contact details here.
