Capable of releasing/collecting semiconductor wafers at any stage by constant support of the semiconductor wafer using a supporting wafer. Especially recommended for semiconductor wafer backgrind processing.
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| Product No. | NWS-TS322F |
| Thickness [μm] | 148 |
| Adhesive strength of thermal release adhesive
(normal state) [N/20mm] (to silicon) | 1.7 |
| Adhesive strength of thermal release adhesive
(after heat treatment) [N/20mm] (to silicon) | 0.2 or Less |
| Adhesive strength of pressure-sensitive adhesive
[N/20mm] (to silicon) | 1.5 |
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