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High Density and Precision Flexible Printed Circuit

Super-fine features created from a combination of circuit production technology and designing technology. We will meet the line pitch requirement by utilizing these two processing technologies.

Features

Subtractive

  • High resolution etching technology enables high aspect ratio line processing.

Semi-additive

  • Because the conductor shape is not trapezoidal, top width is maintained even at fine pitch.
  • No need to make the conductor thin to gain top width.

Specs and Technical info

Subtractive process
Conductor thickness Nominal width Etch factor
12μm[1/3oz] Line/Space=25/25μm(Precision:<5μm) Over 3

Semi-additive process
Conductor thickness Nominal width Etch factor
<15μm(Precision:<4μm) Line/Space=20/20μm(Precision:<3μm) ∞

Application

  • For liquid crystal module applications.

[Remarks]

  • *The figures are typical test results, and are not guaranteed values.
  • *Application samples are only examples. Please evaluate the actual product thoroughly before usage.
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TEL +32-89-360111

Business Hours (WET) 8:00h-17:00h Except for Sat, Sun, and Holidays
Nitto is present in 14 countries in the EMEA region. Find your local contact details here.

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E-mail
TEL +32-89-360111

Business Hours (WET) 8:00h-17:00h Except for Sat, Sun, and Holidays
Nitto is present in 14 countries in the EMEA region. Find your local contact details here.

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