It is and insulating / moistureproof coating material that protects the printed circuit board which is most important part of electronic equipment from harsh environments such as outdoor high temperature and high humidity.

• Offers low Young's modulus, small thermal expansion coefficient, excellent moisture-proofing, waterproofing, insulating, dust-proofing, and protective properties.
• Features remarkable, reliable adhesion, quick film formation (3 to 15 minutes after application), strong elasticity, and anti-corrosion properties.

Item	Unit	LSS-520MH	LSS-540E	Measurement Conditions
Solid content	%	25	40
Solution viscosity	mPa ·s	400	12	25℃/ 77°F
Young's modulus	MPa	75	9.2	Tensile speed 0mm/min
Elongation rate	%	460	500	Tensile speed 300mm/min
Water-vapor perme ability	g/cm²-day	0.002	0.0035	40℃/ 104°F * 90%
				Coating thickness:100µm
Volume resistivity	Ω·cm	3.3 * 10^16	2.4 * 10^16	JIS C2107
Dry to touch	min.	5	15	Coating thickness:20µm

[Extra Info]

• * Measurements provided here are measurement value examples and are not guaranteed.