HR-S051 is a release film compounded polyimide film with fluoroplastic (PTFE) layer. This film has thermal stability from PI (polyimide) with excellent releasability of PTFE. It has splendid heat resistance, mechanical strength, dimensional stability, and releasability. Thin film allows remarkable thermal and electric conduction, and still able to be used in high temperature environment more than 300℃.
 |
 |
| Item | Unit | Characteristic value | |
|---|---|---|---|
| Thickness | mm | 0.03 | |
| MIL | 1.18 | ||
| Tensile strength | MPa | 205 | |
| Elongation | % | 50 | |
| Surface roughness (Rmax) | um | 0.5~1 | |
| MIL | 0.019 to 0.039 | ||
| Thermal conductivity | W/(m-k) | 0.15 | |
| Dimensional change rate
300℃×1 minute |
MD | % | -0.04 |
| TD | -0.02 | ||
| Heat Resistance
|
Sliding Properties
|
Electrical Insulation
|
| Chemical Resistance
|
Mold Release Properties
|
Weather Resistance
|
Business Hours (EST) 8:00 a.m.-5:30 p.m. Except for Sat, Sun, and Holidays
Adobe Reader is required to view PDF files.
If not yet installed, please download it from the Adobe website.
