Protection Tape Applicator (with Vacuum + Pressing function) NEL SYSTEM™ series

This equipment is full-auto type Tape applicator, applies protection tape (for back-grinding process) on 300mm wafer patterned surface in vacuum condition. Mechanical pressing function is also equipped.

For the wafers having bumps or concave-convex, Tape applying performance can be significantly improved by using Vacuum mounting function & Mechanical pressing function.

DV3000

Full auto Protection Tape Applicator for 300mm wafer (Vacuum applying + Pressing function)

Operation flow

Features

FOUP/Open cassette available
Void-less applying to bump wafer can be realized by Differential pressure applying / Flat plate pressing
Easy operation by Touch panel & Recipe function
Log file function standard equipment
Follow to CE mark / SEMI S2/S8
Adding Wafer mapping scanner available
Adding SECS/GEM available

Basic spesifications

Applicable frame size：　300mm
Applicable wafer size：　300mm
Applicable wafer thickness：　775um
Throughput：　45wafers/hr.

*Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.

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