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Wafer Re-Mounter (MA3000III + Frame removal unit) NEL SYSTEM™ series

This equipment is full-auto type Wafer Re-mounter for 300mm wafer, first removes the frame from wafer-mount-frame by support tape, and next mounts the wafer on the new frame by dicing tape, and removes the support tape from the wafer

First removes the frame from wafer-mount-frame by support tape And next mounts the wafer on the new frame by dicing tape, and removes the support tape from the wafer

MA3000III+ Frame removal unit

Wafer Remountersemicon_backgrinding_img_icon_ce

"Full-auto Wafer Remounter for 300mm wafer (MA3000III + Frame removal unit)"

Operation flow

Features

  • Bump wafer available
  • Thin wafer available
  • Available as normal Wafer Mounter
  • Wafer transfer robot with flip function
  • Easy operation by Touch panel & Recipe function
  • Log file function standard equipment
  • Adding Wafer mapping scanner available (For Normal Wafer Mounter)
  • Adding SECS/GEM available
  • Follow to CE mark / SEMI S2/S8

Basic spesifications

  • Applicable frame size：　300mm
  • Applicable wafer size：　300mm
  • Applicable wafer thickness：　100um or more
  • Throughput：　Frame removal unit：App.30wafers／hr.　MA3000III: Roll tape: 40wafers/hr.   Pre-cut tape: 45wafers/hr.
  • *Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
    In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.
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