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Vacuum Wafer Mounter NEL SYSTEM™ series

This equipment is Wafrer Mounter in vacuum condition. Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.

MA2008IIV

MA2008IIVsemicon_backgrinding_img_icon_ce

Full-auto Vacuum Wafer Mounter for 200mm wafer

Operation flow

Features

  • Combination of various applications are available:
    • DSC, Coin-stack
    • Non-contact arm, Non-contact table
    • Protection tape peeling / UV irradiation
    • Panel mounting
  • Vacuum mounting & Normal mounting available
  • TAIKO wafer available
  • Easy operation by Touch panel & Recipe function
  • Log file function standard equipment
  • Adding Wafer mapping scanner available
  • Adding SECS/GEM available
  • Follow to CE mark / SEMI S2/S8

Basic spesifications

  • Applicable frame size：　8 inch／6 inch
  • Applicable wafer size：　8／6／5／4 inch
  • Applicable wafer thickness：　TAIKOwafer：50um or more  Normal wafer: 200um or more（Contact table）、250um or more（Non-contact table）
  • Throughput：　TAIKO wafer：35wafers/hr.   Normal wafer：40wafers/hr.
  • *Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
    In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.

MSA840VIII

MSA840VIII

Semi-auto Vacuum Wafer Mounter for 200mm wafer

Operation flow

Features

  • Semi-auto type 200mm Vacuum wafer mounter
  • Void-less applying to bump wafer can be realized by Differential pressure applying / Flat plate pressing
  • Table heating function (Max, setting temp.: 120deg.C)
  • Non-contact table available
  • DCT/NCF 2in1 available

Basic spesifications

  • Applicable frame size：　8 inch／6 inch
  • Applicable wafer size：　8／6／5／4 inch
  • Applicable wafer thickness：　TAIKOwafer：50um or more  Normal wafer200um or more（Contact table）、250um or more（Non-contact table）
  • Throughput：
    Mounting in vacuum:  TAIKO wafer: App.100sec./wafer
    Normal wafer: App.90sec./wafer
    Mounting in atmosphere:  App.40sec.／wafer
  • *Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
    In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.

MSV300

MSV300 (Design stage)

Semi-auto Vacuum Wafer Mounter for 300mm wafer

Operation flow

Features

  • Semi-auto type 300mm Vacuum wafer mounter
  • Void-less applying to bump wafer can be realized by Differential pressure applying / Flat plate pressing

Basic spesifications

The detailed specification is under designing
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