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Semiconductor Production Process Film NITOFLON™ Release Film for Molding Process MPS Series

MPS series are PTFE release film products for molding process with superior heat resistance and releasability.

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Features

  • Recommended operating temperature range is from -100℃ to 260℃ for continuous use, and can be used even in higher temperature for a short period.
  • Adhesive substances would hardly attached to the film, and even if it attaches, it can be ealisiy removed.
  • Product lineups are Standard type, Low thermal expansion type,  and High-strength/high thermal contraction type.

Structure

Applications

  • Mold release during semiconductor chip resin sealing
  • Releasing from resin
  • Protect mold from sticking excess sealing resin
  • Reduce solvent

Properties

Property Unit (Nitto)PTFE Film t0.05mm
MPS-10 MPS-11 MPS-13
Tensile Strenght MD MPa 50 58 79
TD 40 38 39
Elongation MD % 300 258 120
TD 340 351 335
Coefficient of thermal Expansion MD 10-6/℃ 0 33 -527
TD 333 186 219
Surface roughness um 0.27 0.20 Gloss surface 0.24
Matte surface 0.36
Melting Point ℃ 370
Usable temperature
(Continuous use)
260
Feature Standard Low Thermal Expansion ・High strength
・High thermal contraction
*This data represents examples of measured values, and not guaranteed values.

Experimental video

YouTube Video
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CO2 Separation Membrane Technology Video #1
CO2 Separation Membrane Technology Video #2

Contact Us

Customer Support Center

TEL +91-124-4221604

Business Hours(India time)08:30-17:00 Except for Second Sat of each month, Sun, and Holidays

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