High Density and Precision Flexible Printed Circuit
Super-fine features created from a combination of circuit production technology and designing technology. We will meet the line pitch requirement by utilizing these two processing technologies.
Features
Subtractive
- High resolution etching technology enables high aspect ratio line processing.
Semi-additive
- Because the conductor shape is not trapezoidal, top width is maintained even at fine pitch.
- No need to make the conductor thin to gain top width.
Specs and Technical info
Subtractive process
| Conductor thickness |
Nominal width |
Etch factor |
| 12μm[1/3oz] |
Line/Space=25/25μm(Precision:<5μm) |
Over 3 |
Semi-additive process
| Conductor thickness |
Nominal width |
Etch factor |
| <15μm(Precision:<4μm) |
Line/Space=20/20μm(Precision:<3μm) |
∞ |
Application
- For liquid crystal module applications.
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