UV Irradiator for Dicing Process NEL SYSTEM™ Series
This equipment irradiated UV light to dicing tape on the wafer back side to reduce the adhesion strength . Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.
*Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.
UA8400
UA8400
Full-auto UV irradiator for 200mm wafer
Operation flow
Features
8"/6" frame available
UV irradiation time automatically calculation
Irradiation area expand (To Frame area)
N2 purge
Check mark stamp after UV irradiation
Easy operation by Touch panel & Recipe function
Log file function standard equipment
Follow to CE mark / SEMI S2/S8
Basic spesifications
Applicable frame size: 8 inch/6 inch
Applicable wafer size: 8/6/5/4 inch
Throughput: TAIKOwafer:100wafers/hr.
*Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.
UM810/UM110
UM810: Semi-auto UV irradiator for 8" wafer
UM110: Semi-auto UV irradiator for 6" wafer
Applicable frame size: UM810:8 inch/6 inch UM110:6 inch
Applicable wafer size: UM810:8/6/5/4 inch UM110:6/5/4 inch
*Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.
Business Hours (WET) 8:00h-17:00h Except for Sat, Sun, and Holidays
Nitto is present in 14 countries in the EMEA region. Find your local contact details here.
Business Hours (WET) 8:00h-17:00h Except for Sat, Sun, and Holidays
Nitto is present in 14 countries in the EMEA region. Find your local contact details here.