Protection Tape Remover from TAIKO™ Wafer NEL SYSTEM™ series
This equipment is full-auto type Tape remover, removes protection tape (for back-grinding process) from TAIKO wafer patterned surface .
HR9000
HR9000
Full-auto Tape Remover for 200mmTAIKO wafer
Operation flow
Features
TAIKO wafer available
Non-contact transferring by Bernoulli method
Contamination-less transferring (by using Twin arm Robot)
Stable peeling performance by Peeling bar, Peeling trigger, Edge keeper
(Peeling trigger & Edge keeper: Option)
Low stress peeling by partly peeling tape applying
Easy operation by Touch panel & Recipe function
Follow to CE mark / SEMI S2/S8
Adding SECS/GEM available
Basic spesifications
Applicable wafer size： 8 inch／6 inch
Applicable wafer thickness： TAIKOwafer：50um or more,
Normal wafer: 150um or more
Throughput： TAIKOwafer：30wafers/hr.
Normal wafer： 50wafers/hr
*Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.
Business Hours (WET) 8:00h-17:00h Except for Sat, Sun, and Holidays
Nitto is present in 14 countries in the EMEA region. Find your local contact details here.
Business Hours (WET) 8:00h-17:00h Except for Sat, Sun, and Holidays
Nitto is present in 14 countries in the EMEA region. Find your local contact details here.
