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Protection Tape Applicator (with Vacuum + Pressing function) NEL SYSTEM™ series

This equipment is full-auto type Tape applicator, applies protection tape (for back-grinding process) on 300mm wafer patterned surface in vacuum condition. Mechanical pressing function is also equipped.

For the wafers having bumps or concave-convex, Tape applying performance can be significantly improved by using Vacuum mounting function & Mechanical pressing function.

DV3000

DV3000semicon_backgrinding_img_icon_ce

Full auto Protection Tape Applicator for 300mm wafer (Vacuum applying + Pressing function)

Operation flow

Features

  • FOUP/Open cassette available
  • Void-less applying to bump wafer can be realized by Differential pressure applying / Flat plate pressing
  • Easy operation by Touch panel & Recipe function
  • Log file function standard equipment
  • Follow to CE mark / SEMI S2/S8
  • Adding Wafer mapping scanner available
  • Adding SECS/GEM available

Basic spesifications

  • Applicable frame size：　300mm
  • Applicable wafer size：　300mm
  • Applicable wafer thickness：　775um
  • Throughput：　45wafers/hr.
  • *Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
    In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.
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TEL +32-89-360111

Business Hours (WET) 8:00h-17:00h Except for Sat, Sun, and Holidays
Nitto is present in 14 countries in the EMEA region. Find your local contact details here.

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Contact Us

E-mail
TEL +32-89-360111

Business Hours (WET) 8:00h-17:00h Except for Sat, Sun, and Holidays
Nitto is present in 14 countries in the EMEA region. Find your local contact details here.

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