ELP WS-01 is UV curable adhesive tape. It support for the dicing process of semiconductor wafer manufacturing. Before UV tape hold the wafer firmly at dicing process. After UV tape release die easily at diebonding process.
 |
| Thickness [mm] | Width [mm] | Length [m] | Color |
| 0.075 | 300,400 | 100 | half transparent |
| Item | Unit | ELP WS-01
|
|
| Thickness | mm | 0.075 | |
| Adhesive strength on Siwfer
|
Before UV
|
N/20mm
|
7.00 |
| After UV
|
N/20mm
|
0.10 | |
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