MA3000III
Full-auto Wafer Mounter for 300mm wafer
Operation flow
Features
- FOUP/Open cassette available
- Roll tape/Pre-cut tape available(standard)
- Peeling after mount function(standard)
- UV function for BG/T(option)
- Thin wafer capability(option)
- Easy operation by Touch panel & Recipe function
- Log file function standard equipment
- Adding Wafer mapping scanner available
- Adding SECS/GEM available
- Follow to CE mark / SEMI S2/S8
Basic spesifications
- Applicable frame size： 300mm／200mm
- Applicable wafer size： 300mm／200mm
- Applicable wafer thickness： 50μm or more(Thin wafer version)
- Throughput： Roll tape: 43wafers/hr. Pre-cut tape: 50wafers/hr.
MA2008IIR/ MA2008IIP
Full-auto Wafer Mounter for 200mm wafer
Operation flow
Features
- Combination of various applications are available:
- DSC, Coin-stack
- Non-contact arm, Non-contact table
- Protection tape peeling / UV irradiation
- Panel mounting
- MA2008IIR: for Roll tape
- MA2008IIP: for Pre-cut tape
- Easy operation by Touch panel & Recipe function
- Log file function standard equipment
- Adding Wafer mapping scanner available
- Adding SECS/GEM available
- Follow to CE mark / SEMI S2/S8"
Basic spesifications
- Applicable frame size： 8 inch／6 inch
- Applicable wafer size： 8／6／5／4 inch
- Applicable wafer thickness： 200um or more（Contact table）、250um or more（Non-contact table）
- Throughput： MA2008IIR：75wafers/hr. MA2008IIP：75wafers/hr.
