Protection Tape Applicator (with Vacuum + Pressing function) NEL SYSTEM™ series

This equipment is full-auto type Tape applicator, applies protection tape (for back-grinding process) on 300mm wafer patterned surface in vacuum condition. Mechanical pressing function is also equipped.

For the wafers having bumps or concave-convex, Tape applying performance can be significantly improved by using Vacuum mounting function & Mechanical pressing function.

DV3000

Full auto Protection Tape Applicator for 300mm wafer (Vacuum applying + Pressing function)

Operation flow

Features

FOUP/Open cassette available
Void-less applying to bump wafer can be realized by Differential pressure applying / Flat plate pressing
Easy operation by Touch panel & Recipe function
Log file function standard equipment
Follow to CE mark / SEMI S2/S8
Adding Wafer mapping scanner available
Adding SECS/GEM available

Basic spesifications

Applicable frame size：　300mm
Applicable wafer size：　300mm
Applicable wafer thickness：　775um
Throughput：　45wafers/hr.

*Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.

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Protection Tape Applicator (with Vacuum + Pressing function) NEL SYSTEM™ series

This equipment is full-auto type Tape applicator, applies protection tape (for back-grinding process) on 300mm wafer patterned surface in vacuum condition. Mechanical pressing function is also equipped.

DV3000

DV3000

Operation flow

Features

Basic spesifications

Contact Us

For inquiries about products.

Contact Us

Business Hours：9:00-17:30 (Japan Time)

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