HR3000III
Full-auto Tape Remover for 300mm wafer
Operation flow
Features
- FOUP/Open cassette available
- Stable peeling performance by Peeling Trigger
- Low stress peeling by accurate control of Peeling bar
- Easy operation by Touch panel & Recipe function
- Log file function standard equipment
- Follow to CE mark / SEMI S2/S8
- Adding Wafer mapping scanner available
- Adding SECS/GEM available
Basic spesifications
- Applicable wafer size： 300mm／200mm
- Applicable wafer thickness： 100um or more
- Throughput： Max65wafers/hr.
HR9300
Full-auto Tape Remover for 300mmTAIKO wafer
Operation flow
Features
- TAIKO wafer available
- Non-contact transferring by Bernoulli method
- Stable peeling performance by Peeling bar, Peeling trigger, Edge keeper
(Peeling trigger & Edge keeper: Option)
- Low stress peeling by partly peeling tape applying
- Easy operation by Touch panel & Recipe function
- Follow to CE mark / SEMI S2/S8
- Adding SECS/GEM available
Basic spesifications
- Applicable wafer size： 300mm
- Applicable wafer thickness： 50μm or more
- Throughput： Max.50wafers/hr.
HR8500III
Full-auto Tape Remover for 200mm wafer
Operation flow
Features
- 8""/6""/5"" wafer available
4"" wafer handling (Option)
- Table heating function
- Thin wafer available (TW version)
- Easy operation by Touch panel
- Follow to CE mark
- Adding SECS/GEM available
Basic spesifications
- Applicable wafer size： 8/6/5/4 inch
- Applicable wafer thickness： 250um or more、 TW version：150um or more
- Throughput： Max.85wafers/hr.(TW version : Max.68wafers/hr.)
HR9000
Full-auto Tape Remover for 200mmTAIKO wafer
Operation flow
Features
- TAIKO wafer available
- Non-contact transferring by Bernoulli method
- Contamination-less transferring (by using Twin arm Robot)
- Stable peeling performance by Peeling bar, Peeling trigger, Edge keeper
(Peeling trigger & Edge keeper: Option)
- Low stress peeling by partly peeling tape applying
- Easy operation by Touch panel & Recipe function
- Follow to CE mark / SEMI S2/S8
- Adding SECS/GEM available
Basic spesifications
- Applicable wafer size： 8 inch／6 inch
- Applicable wafer thickness： TAIKOwafer：50um or more,
- Throughput： Max.50wafers/hr
HSA840II
Semi-auto Tape Remover for 200mm wafer
Operation flow
Features
- 8""/6""/5""/4"" wafer available
- 8""- 4"" wafer handling available by 1 table
- Easy operation by Touch panel
- Follow to CE mark / SEMI S2/S8"
Basic spesifications
- Applicable wafer size： 8/6/5/4 inch
- Applicable wafer thickness： 250um or more
- Throughput： App.50sec.／wafer
RHSA840II
Semi-auto Tape Remover for 200mm wafer
Operation flow
Features
- Peeling the protection tape from Wafer-mount-frame
- 8"/6"/5"/4" wafer available
- 8" frame available（6" frame: Option）
- 8"- 4" wafer handling available by 1 table
- Peeling protection tape from stand-alone wafer (Option)
- Easy operation by Touch panel
- Follow to CE mark & SEMI S2/S8
Basic spesifications
- Applicable frame size： 8 inch, (6 inch: Option)
- Applicable wafer size： 8/6/5/4 inch
- Applicable wafer thickness： 100um or more、 250um or more（for stand-alone wafer)
- Throughput： 50sec.／wafer
