Features

• FOUP/Open cassette available
• Low tension applying / Applying stress control
• Easy operation by Touch panel & Recipe function
• Log file function standard equipment
• Tape sagging detection function
• Follow to CE mark & SEMI S2/S8
• Adding Wafer mapping scanner available
• Adding SECS/GEM available

Basic specifications

• Applicable wafer size：　300mm／200mm
• Applicable wafer thickness：　400um or more
• Throughput：　Max.88wafers/hr.

• ※Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
  In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.

Features

• 8""/6""/5"" wafer available
  4"" wafer handling function (Option)
• Low tension applying function available
• Adding Table/ Roller heating function available
• Easy operation by Touch panel
• Follow to CE mark
• Adding SECS/GEM available

Basic spesifications

Features

• 8"/6"/5"/4" wafer available
• 8"- 4" wafer handling available by 1 table
• Easy operation by Touch panel
• Wafer setting manually by hand, Tape applying and cutting automatically

Basic spesifications

• Applicable wafer size：　8/6/5/4 inch
• Applicable wafer thickness：　Non back grinding wafer
• Throughput：　App.50sec.／wafer

• ※ Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
  In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.