This adhesive film is for fixing IC chips to a lead frame or interposer in the semiconductor assembly process. It is useful in realizing high adhesive reliability and in BOC and stacked CSP manufacturing processes, solving conventional silver paste bleeding problems which cause short circuits. It has also been designed to enable use in a continuous process in combination with fixing tape for dicing.
 |
| Chip size | Surface
flatness | Line-up | Properties | |||
|---|---|---|---|---|---|---|
| Thickness
[µm] | Wafer
size [mm] | Supply form | ||||
| C/C | >2mm | Flat | EM-700 series
(non-cure) | 10-40 | 200
300 | Precut/Non-precut |
| Small | Flat | EM-310/400 series
(cure) | ||||
| C/S | - | Rough | ||||
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