Heat Resistance Back Grinding Tape

Back-grinding tape with heat resistance is for special heating process after wafer grinding.

Heat resistance back grinding tape can correspond to the secondary process of wafer backside. After the back-grinding process, the wafers with the heat resistance back grinding tape can be processed (wet etching, ashing, metalizing, exposure/processing and so on).

Features
Structure
Applications

Features

Excellent TTV (Total Thickness Variation) performance.
High heat resistance for the wafer backside process.
Easy peeling off from ground wafers after several kinds of wafer backside processes.

Structure

Applications

Wet etching or metalizing process of wafer backside of power devices, discrete devices, etc.
Complicated process in backside of wafer, like IGBT etc.
Other semiconductor processes which require a certain amount of heating.