Product |
SK-229 (A room temperature curing adhesive) | ||
Main-agent | Curing-agent | Mixture | |
Color | Blue | Yellow | Green |
Base | Epoxy | Amine | ー |
Mixing ratio (By weight) | 1 | 1 | ー |
Curing conditon | ー | ー | 20~100℃
e.g.24℃ x 24 hr,100℃ x 60 |
Actual operating temperature | ー | ー | -269~80˚C |
Pot life@RT | ー | ー | 120min |
Viscosity@25℃ | 80Pa・s | 100Pa・s | 80~90Pa・s |
Specific gravity@20℃ | 1.4 | 1.3 | 1.4 |
Gel time@100℃ | ー | ー | Within 10min |
Curing shrinkage | ー | ー | 2% or less |
Item | SK-229 (A room temperature curing adhesive) | Measurement condition@RT |
Tensile modulus | 3010MPa | Tensile testers
Tensile speed 5mm/min |
Tensile strength | 22.3MPa | Same as above |
Shear strength | 22MPa@24℃ | Same as above |
30MPa@-196℃ | Same as above | |
Thermal conductivity | 0.33W/m・k | Xe flash method |
Glass transition point(Tg) | 66.5℃ | DMS method |
Coefficient of thermal expansion | 6.4ppm/℃@-80~-70℃ | TMA method |
50.3ppm/℃@25~50℃ | ||
67.7ppm/℃@100~125℃ |
1.Measurment | 2.Mixing |
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