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Thin-film Metal Base Board CISFLEX™

Forms a high resolution circuit with photosensitive Pl and semi-additive copper plating on a metal base.

Features

  • High density
  • High dimensional precision
  • Metal base

Construct

Connection Methods

Solder Bump

  • A coreless bump is formed with solder paste.
  • Can be thermally bound.

Flying Lead

The entire flying lead is Ni-Au plated. Can be bonded by normal temperature ultrasonic wave.

Process Accuracy

Gold-ball Bonding Pad

Flying Lead

Back Side Pad

[Remarks]

  • *SUS is used as the base metal.
  • *Double-sided pads are available.
  • *The plating on the pad and the flying lead is either Ni-Au or Au.

Applications

  • Hard disk drive
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Customer Support Center

TEL +91-124-4221604
Business Hours(India time)08:30-17:00
Except for Second Sat of each month, Sun, and Holidays

E-mail
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