TAIKO™ process and temporary carrier technology has been developed for very thin wafer processes in TSV (Trough-Silicon Via) wafers and IGBT. In these areas, solvent cleaning is necessary, but such very thin wafers cannot be handled without any support tapes. The solvent resistance dicing tape can support very thin wafers during the solvent cleaning process and it can be diced afterword.
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Business Hours (EST) 8:00 a.m.-5:30 p.m. Except for Sat, Sun, and Holidays
TEL 1-800-755-8273
Business Hours (EST) 8:00 a.m.-5:30 p.m.
Except for Sat, Sun, and Holidays
