Heat resistance back grinding tape can correspond to the secondary process of wafer backside. After the back-grinding process, the wafers with the heat resistance back grinding tape can be processed (wet etching, ashing, metalizing, exposure/processing and so on).
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Business Hours (EST) 8:00 a.m.-5:30 p.m. Except for Sat, Sun, and Holidays
TEL 1-800-755-8273
Business Hours (EST) 8:00 a.m.-5:30 p.m.
Except for Sat, Sun, and Holidays
