MV3000
Full-auto Vacuum Wafer Mounter for 200mm wafer
Operation flow
Features
- FOUP/Open cassette available
- Wafer mounting under vacuum condition
- TAIKO wafer available
- Easy operation by Touch panel & Recipe function
- Log file function standard equipment
- Adding Wafer mapping scanner available
- Adding SECS/GEM available
- Follow to CE mark / SEMI S2/S8
Basic spesifications
- Applicable frame size：300mm
- Applicable wafer size：300mm
- Applicable wafer thickness： TAIKOwafer：50um or more
- Throughput：Max. 30wafers/hr.
MA2008IIV
Full-auto Vacuum Wafer Mounter for 200mm wafer
Operation flow
Features
- Combination of various applications are available:
- DSC, Coin-stack
- Non-contact arm, Non-contact table
- Panel mounting
- Wafer mounting under vacuum condition
- TAIKO wafer available
- Easy operation by Touch panel & Recipe function
- Log file function standard equipment
- Adding Wafer mapping scanner available
- Adding SECS/GEM available
- Follow to CE mark / SEMI S2/S8
Basic spesifications
- Applicable frame size： 8 inch
- Applicable wafer size： 8 inch／6 inch／5 inch／4 inch
- Applicable wafer thickness： TAIKOwafer：50um or more Normal wafer: 200um or more（Contact table）、250um or more（Non-contact table）
- Throughput：Max. 50wafers/hr.
MSA840VIII
Semi-auto Vacuum Wafer Mounter for 200mm wafer
Operation flow
Features
- Semi-auto type 200mm Vacuum wafer mounter
- Void-less applying to bump wafer can be realized by Differential pressure applying / Flat plate pressing
- Table heating function
- Non-contact table available
Basic spesifications
- Applicable frame size： 8 inch
- Applicable wafer size： 8 inch／6 inch／5 inch／4 inch
- Applicable wafer thickness： TAIKOwafer：50um or more Normal wafer200um or more（Contact table）、250um or more（Non-contact table）
- Throughput：Approx.120sec/wafer
MSV300
Semi-auto Vacuum Wafer Mounter for 300mm wafer
Operation flow
Features
- Semi-auto type 300mm Vacuum wafer mounter
- Void-less applying to bump wafer can be realized by Differential pressure applying / Flat plate pressing
Basic spesifications
- Applicable frame size：300mm
- Applicable wafer size：300mm/200mm
- Applicable wafer thickness： TAIKO wafer ： 100um or more、 normal wafer ： 200um or more
- Throughput： Approx. 150sec/wafer
