DSP1220 (60) 是一种含聚酯基材的、低排气和无硅*双面胶带。
它非常适合修复有可能产生气体排放的电子设备零件和组件。
本品具有出色的可处理性和可加工性,适合用于在冲压加工后拾取因粘合剂重新粘合不足而产生的碎渣。
*无硅:指未有意使用无硅树脂材料。
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