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PI Carrier Adhesive Tape AS-020PI12

Bonding electric exterior components

Superior adhesion to various substrates. Thin polyimide base film can contribute for the thinner devise design

Features

  • Superior adhesion to various substrates 
  • Thin polyimide base film can contribute for the thinner devise design.

Structure

Properties

Tape thickness[mm] 0.03
180 degrees peeling adhesion[N/20mm] 6.7
Holding power[mm] 0.02

Applications

  • Bonding electric exterior components.

Contacto

TEL +55-11-2450-6600 FAX +55-11-2450-6601

Horario laboral (Brasil):8:00-17:00 (excepto sábados, domingos y fiestas nacionales)

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Contacto

TEL +55-11-2450-6600
FAX +55-11-2450-6601
Horario laboral (Brasil)
8:00-17:00 (excepto sábados, domingos y fiestas nacionales)