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Tightly adheres and can easily be peeled off just by heating; perfect for temporary fixing.
A new type of curing tape suitable for various purposes.
Insulation tape for CRT degaussing coils boasts the world's No.1 share.
Masking/surface protection material developed for leading-edge electronics and optical fields.
Low contamination type developed for surface protective of electronic and optical parts.
Optical grade protective material with an antistatic property produced in a class 1000 clean environment.
Surface protective materials with an antistatic properties that are ideal for applications that do not tolerate static electricity such as LCD panels.
Low adhesion release and UV release. Outstanding characteristics support the backgrind process of wafer manufacturing.
Achieves high reliability by combining dicing and die attachment functions.
Dicing tape with solvent resistance is for special processes like TSV wafers.
Wafer processing tape designed for semiconductor dicing processes.
Wafer processing tape designed for excellent stability under various conditions of processing.
Semiconductor wafer tape for dicing processes
Semiconductor wafer processing tape designed for excellent stability under various conditions of processing.
Business Hours(Taiwan time)08:30-17:30(Except for Sat, Sun, and Holidays)
