Thermal conductivity insulation sheet with excellent heat dissipation for power semiconductors BPM

Composed of thermosetting resin and heat-dissipating filler with excellent insulation and heat dissipation sheet product.

Composed of thermosetting resin and heat-dissipating filler with excellent insulation and heat dissipation sheet.
Extremely thin(～200μm) compared to conventional materials such as ceramics, contributing to inverter miniaturization and weight reduction.

[Remarks]
*The figures are a sample of observed values, not guaranteed performance.

This thermal conduction sheet is effective for heating and cooling of integrated circuit devices, etc.

Business Hours(Japan time) 8:00-17:00 Except for Sat, Sun, and Holidays