| Product No. |
BPM11 |
BPM12 |
| Structure |
PET[μm] |
100 |
| Insulation layer[μm] |
150~200 |
| Thermal conductivity[W/mK] |
7 |
12 |
| Adhesive strength[N/cm] |
Adherent: Copper foil 3oz |
10 |
4 |
| Tensile angle: 90degrees |
| Glass transition point(Tg) |
155 |
220 |
| CTE[1/K] |
α1 |
19X10-6 |
19X10-6 |
| Breakdown voltage[kV] |
|
10kV or higher/150μm |
| Bonding Process*1 |
120℃（Temporary bonding） |
1MPa/2min |
3MPa/2min |
| 180℃（Main curing） |
1MPa/180min |
3MPa/20min |
[Remarks]
*The figures are a sample of observed values, not guaranteed performance.
*1 Please consult us regarding the bonding process, as results may vary depending on the substrate and pressing conditions.
