Thermal conductivity insulation sheet with excellent heat dissipation for power semiconductors BPM

Composed of thermosetting resin and heat-dissipating filler with excellent insulation and heat dissipation sheet product.

Composed of thermosetting resin and heat-dissipating filler with excellent insulation and heat dissipation sheet.
Extremely thin(～200μm) compared to conventional materials such as ceramics, contributing to inverter miniaturization and weight reduction.

[Remarks]
*The figures are a sample of observed values, not guaranteed performance.

This thermal conduction sheet is effective for heating and cooling of integrated circuit devices, etc.

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