Labels Primarily For Printed Circuit Board Implementation PI25A01/PI50A01

Polyimide label mainly used in soldering process in manufacturing printed circuit boards.

Polyimide film based label. Offers excellent resistance to heat (300°C) . It is mainly used in soldering process in manufacturing printed circuit boards.
Used with DURAPRINTER and other thermal transfer printers for on-site printing.
Print with DURA Ink H (dedicated ink ribbon) for excellent scratch-resistant labels.

Printed circuit board labels.
Labels for electronic components (air bags, crystal oscillators, ROM, semiconductors).

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