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Electronic Devices

Electronic Components

Chip Parts

Application examples of Nitto products are introduced here including adhesive tapes.

  1. 1. Sheeting
  2. 2. Laminate/Press
  3. 3. Cut

    For cutting during chip component manufacturing

    Effective for process rationalization

    • Temporary
      fixing
    • Cutting
    • Release
      by heating

    Heat release sheet for temporary fixing during the manufacturing process

    REVALPHA

  4. 4. Baking
  5. 5. Plating
  6. 6. Inspection
  7. 7. Packaging
  8. 8. Shipment

Battery

For cell terminal insulation

Useful for improving workability and reliability

PPS base adhesive tape for heat-resistant insulation

PP base adhesive tape with excellent anti-solvent properties

For device termination

Useful for improving workability and reliability

PPS base adhesive tape for heat-resistant insulation

PP base adhesive tape with excellent anti-solvent properties

For insulating the bottom portion of a cell

Useful for improving workability and reliability

PPS base adhesive tape for heat-resistant insulation

Rigid Board

For prevention of moisture and dust in substrates

Just paint it on to protect substrates from moisture and dust

Moisture prevention, rubber sealant

Sealant featuring quick-dry and flexible capabilities

For masking solder plating

Just stick it on to protect from liquid plating

PET-based, plating masking tape

Masking tape featuring excellent chemical resistance and adhesion

Flexible Printed Circuit Boards

Super-fine features created from a combination of circuit production technology and designing technology. We will meet the line pitch requirement by utilizing these two processing technologies.

An environmentally-friendly halogen free FPC attaining high grade of flame-resistance (under UL94VTM-O) without the use of halogens or antimony as the flame retardant.

A circuit board which reduces the bias force with a thin base Pl to combine improved flexibility with double-sided micro line processing.

Forms a high resolution circuit with photosensitive Pl and semi-additive copper plating on a metal base.