Heat resistance back grinding tape can correspond to the secondary process of wafer backside. After the back-grinding process, the wafers with the heat resistance back grinding tape can be processed (wet etching, ashing, metalizing, exposure/processing and so on).
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Business Hours(Taiwan time)08:30-17:30
Except for Sat, Sun, and Holidays
Business Hours(Taiwan time)08:30-17:30 (Except for Sat, Sun, and Holidays)
