• TAIKO wafer available
• Non-contact transferring by Bernoulli method
• Contamination-less transferring (by using Twin arm Robot)
• Stable peeling performance by Peeling bar, Peeling trigger, Edge keeper
  (Peeling trigger & Edge keeper: Option)
• Low stress peeling by partly peeling tape applying
• Easy operation by Touch panel & Recipe function
• Follow to CE mark / SEMI S2/S8
• Adding SECS/GEM available

Basic spesifications

• *Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
  In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.